Features & Capabilities
• Elminate
the need for sorting, dicing and repackaging of the wafer
• Able to analyze at full tester
speeds of up to 8 GHz
• Land more than 10000 pins using a
standard production probe card
• High resolution motorized XYZ
wafer stage with 0.1µm accuracy
• Able to handle 200mm and 300mm
wafers
• ARSIL
option: compatible with full thickness, unthinned wafer